Semiconductor device

ABSTRACT

A display device is provided including a display region arranged with a plurality of pixels, and a first sealing region arranged in an exterior periphery part of the display region, the display region includes an individual pixel electrode arranged in each of the plurality of pixels, a common pixel electrode arranged in upper layer of the individual pixel electrode and in succession to the plurality of pixels, and a light emitting layer arranged between the individual pixel electrode and the common pixel electrode, and the first sealing region includes a sealing layer arranged on a lower layer than the common pixel electrode and a region stacked with the common pixel electrode extending from the display region, the stacked region being enclosed by the display region.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is based upon and claims the benefit of priority fromthe prior Japanese Patent Application No. 2015-006786, filed on Jan. 16,2015, the entire contents of which are incorporated herein by reference.

FIELD

The present application is related to a display device. The embodimentsdisclosed by the present application are related to a sealing structureof a display device.

BACKGROUND

An organic electroluminescence (referred to below as “organic EL”)display device is arranged with a light emitting element in each pixeland an image is displayed by individually controlling the emitted light.A light emitting element includes a structure in which a layer (referredto below as “light emitting layer”) including an organic EL material issandwiched between a pair of electrodes wherein one is an anode and theother is a cathode. In an organic EL display device, one electrode isarranged as an individual pixel electrode for each pixel and the otherelectrode is arranged as a common pixel electrode applied with a commonpotential across a plurality of pixels. The organic EL display devicecontrols light emitted by a pixel by applying a potential of theindividual pixel electrode for each pixel with respect to the potentialof the common pixel electrode.

An organic EL display device has been pointed out as being vulnerable tomoisture after a period of time. Pixels which do not emit light occurwhen the organic EL material which forms the light emitting layerdeteriorates due to moisture. In an organic EL display device, displaydefects due to non-light emitting pixels are referred to as dark spots.

For example, a structure is disclosed in the organic EL display devicein Japanese Laid Open Patent No. 2005-164818 in which a region isarranged for dividing a planarized film formed in order to cover andsmooth an upper side of a substrate in order to prevent the infiltrationof water to the light emitting layer. A component called a bank whichsections a pixel is arranged in a pixel region of the organic EL displaydevice. For example, a structure is disclosed in Japanese Laid OpenPatent No. 2005-302707 in which an aperture part is arranged in thisbank layer and water is prevented from infiltrating due the aperturepart being covered by a common pixel electrode.

SUMMARY

One embodiment of a display device according to the present inventionincludes a display region arranged with a plurality of pixels, and afirst sealing region arranged in an exterior periphery part of thedisplay region, the display region includes an individual pixelelectrode arranged in each of the plurality of pixels, a common pixelelectrode arranged in upper layer of the individual pixel electrode andin succession to the plurality of pixels, and a light emitting layerarranged between the individual pixel electrode and the common pixelelectrode, and the first sealing region includes a sealing layerarranged on a lower layer than the common pixel electrode and a regionstacked with the common pixel electrode extending from the displayregion, the stacked region being enclosed by the display region.

BRIEF DESCRIPTION OF DRAWINGS

FIG. 1 is a perspective view diagram showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 2 is a planar view diagram showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 3 is a cross-sectional diagram showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 4 is a planar view diagram showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 5 is a cross sectional diagram showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 6 is a planar view diagram showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 7 is a cross sectional diagram showing a structure of a displaydevice related to one embodiment of the present invention;

FIG. 8 is a planar view diagram showing a structure of a display devicerelated to one embodiment of the present invention;

FIG. 9 is a cross sectional diagram showing a structure of a displaydevice related to one embodiment of the present invention; and

FIG. 10 is a cross sectional diagram showing a structure of a displaydevice related to one embodiment of the present invention;

DESCRIPTION OF EMBODIMENTS

The embodiments of the present invention are explained below whilereferring to the drawings. However, the present invention can be carriedout using many different variations and should not be interpreted asbeing limited to the contents described in the embodiments exemplifiedbelow. In addition, although the width, thickness and shape etc of eachcomponent are represented schematically compare to the actual componentsin order to clarify the explanation, these are merely examples andshould not limit an interpretation of the present invention.Furthermore, the same reference symbols are attached to the same orsimilar elements that have already appeared previously in thespecification and each drawing and an explanation of such elements maybe omitted as appropriate.

In the present specification, when certain components or regions aredescribed as [above (or below)] other components or regions, unlessspecified otherwise, this includes not only being directly above [ordirectly below] other components or regions, but also above [or below]other components or regions, that is, other structural components may beincluded therebetween.

An organic EL display device includes a complex structure in which aplurality of coating films are stacked and patterned. As a result, as isthe organic EL display device disclosed in the patent document 1, in thecase where a light emitting layer extends from a display region, thereis a problem wherein an end part the light emitting layer contacts abank layer which includes water even if a side surface and upper surfaceof a planarized film are covered by a conductive film. In addition, aproblem occurs wherein water encapsulated in the bank layer infiltratesthe light emitting layer even if waterproof properties of a panelperiphery are improved using the bank layer.

One embodiment of the present invention aims to provide a display devicehaving a structure in which a light emitting layer is protected fromboth moisture infiltrating from the exterior of the display device andmoisture encapsulated within a display region.

Embodiment 1

The structure of a display device 100 related to the present embodimentis explained while referring to FIG. 1. The display device 100 isarranged with a display region 106 in a first substrate 102. The displayregion 106 is formed by arranging a plurality of pixels 108. A secondsubstrate 104 is arranged as a sealing material on an upper surface ofthe display region 106. The second substrate 104 is fixed to the firstsubstrate 102 by a third sealing region 110 which encloses the displayregion 106. The display region 106 formed in the first substrate 102 issealed using a sealing material so that is not exposed to air by thesecond substrate 104 which is a sealing material and the third sealingregion 110. Deterioration of a light emitting element 124 arranged ineach pixel 108 is suppressed by adopting this type of sealing structure.

One end of the first substrate 102 is arranged with a terminal region114. The terminal region 114 is arranged on the exterior side of thesecond substrate 104. The terminal region 114 is formed using aplurality of connection terminals 116. A connection terminal 116 forms aconnection point between devices which output a video signal or powersources and the like, and a wiring substrate connecting a display panel.This connection point in the connection terminal 116 is exposed to theexterior. A driver circuit 112 which outputs a video signal input fromthe terminal region 114 to the display region 106 may be arranged in thefirst substrate 102.

The structure of the display device 100 related to the presentembodiment is explained further while referring to FIG. 2 and FIG. 3.FIG. 2 is a planar view diagram showing the structure of the displaydevice 100 related to the present embodiment. FIG. 3 is across-sectional diagram showing the structure of the display device 100related to the present embodiment.

As is shown in FIG. 2, a plurality of pixels are arranged in a matrixshape in the display region 106 which forms a display screen above thesubstrate 102, and an individual pixel electrode 126 of each electrodeis shown in a planar view. In addition, in the present embodiment, asealing layer 142 is arranged so as to enclose a plurality of individualpixel electrodes 126. A plurality of cathode contacts 118 and a secondsealing region 120 are arranged in a periphery edge part. Aperpendicular scanning circuit or horizontal circuit which input signalsto the display region 106 may be further added as other components.

FIG. 3 is a cross-sectional structure along the line A-B in the displaydevice 100 shown in FIG. 2. As is shown in FIG. 3, each of the pluralityof pixels 108 in the display region 106 includes a transistor 122 andlight emitting element 124. In the case of an organic EL element, thelight emitting element 124 includes a structure in which a lightemitting layer 130 formed from an organic EL material is sandwiched bythe individual pixel electrode 126 and a common pixel electrode 128arranged facing the individual pixel electrode 126. The individual pixelelectrode 126 is independent in each pixel and is connected to eachtransistor 122 respectively.

In the present embodiment, the sealing layer 142 is arranged so as toenclose the periphery of a plurality of pixels 108 arranged in a matrixshape. The sealing layer 142 and common pixel electrode 128 include aregion where they contact (first sealing region), the first sealingregion forms a closed periphery shape in an upper surface view andencloses the plurality of pixels 108 arranged in a matrix shape. Thesealing layer 142 is arranged further to the interior than the sealingregion 120. In this way, the light emitting layer 130 and bank 135outside of the display region 106 are separated. It is preferred that helight emitting layer 130 avoid contact as much as possible with anorganic element such as the bank 135 outside of the display region 106,and it is preferred that as much as possible an end part of the interiorside of the sealing layer 142 is arranged in the vicinity of the mostexterior periphery pixel 108. In addition, it is preferred that an endpart on the exterior side of the sealing layer 142 is arranged as muchas possible in the vicinity of the sealing region 120.

The sealing layer 142 may be formed above an insulation layer 136 as isshown in FIG. 3. That is, the sealing layer 142 can be formed using thesame material and in the same process as the individual pixel electrode126 in the manufacturing process of the display device. In this case, itis possible to form the sealing layer 142 just by a structural changewithout any large change in processes. However, the material and methodfor forming the sealing layer 142 are not limited to these. The sealinglayer 142 may be a material with high water blocking properties, a metalmaterial other than the individual pixel electrode 126 or an insulationmaterial. In the case an insulation material, it is possible to use anitride silicon film with high water blocking properties.

Since the individual pixel electrode 126 reflects light generated by thelight emitting layer 130 to the common pixel electrode 128 side, it ispreferred that the individual pixel electrode 126 is formed from a metalfilm with high reflectance. Alternatively, the individual pixelelectrode 126 may be formed from a stacked structure of a metal film andtransparent conductive film or a structure including a light reflectivesurface. Although it is possible to also form the sealing layer 142using the same material and in the same process as the individual pixelelectrode 126, the material and method used is not limited to this asmentioned previously.

A bank 132 is arranged between two adjacent pixels 108. The bank 132 isarranged so that an end part covers a periphery edge part of theindividual pixel electrode 126. In the present embodiment, the bank 132is further arranged so as to cover an end part of the sealing layer 142.

Since the bank 132 prevents shorting with the common pixel electrode 128without the light emitting layer 130 being sufficiently covered by anend part of the individual pixel electrode 126 and insulates the spacebetween adjacent pixels, it is preferred that the bank 132 is formedusing an insulation material. For example, it is preferred to use anorganic material such as polyimide or acryl or an inorganic materialsuch as silicon oxide when forming the bank 132.

The light emitting layer 130 is arranged in common with a plurality ofpixels 108 and is arranged so as to cover the bank 132 between theindividual pixel electrode 126 and pixel 108. In addition, the lightemitting layer 130 may extend from the display region 106 exceeding themost exterior periphery pixel 108 to cover a part of the sealing layer142.

In the case where the light emitting layer 130 is formed from an organicEL layer for example, the light emitting layer 130 is formed using a lowmolecular or high molecular organic material. In the case where a lowmolecular organic material is used, in addition to including an organicmaterial with light emitting properties, a hole injection layer orelectron injection layer, or a hole transport layer or electrontransport layer may be included to sandwich the light emitting layer130. In the present embodiment, the light emitting layer 130 uses anelement which displays white light emitting properties and a full colorcan be realized using a color filter.

The common pixel electrode 128 arranged above the light emitting layer130 includes a region which contacts with the common pixel electrode 128above the sealing layer 142 as described previously. The region has aclosed periphery shape and encloses a plurality of pixels arranged in amatrix shape. In the case where the light emitting layer 130 extends asfar as the sealing layer 142, the common pixel electrode 128 and sealinglayer 142 covers an end part of the light emitting layer 130. Byadopting this type of structure, the light emitting layer 130 and thebank 135 extending from the exterior side of the display region 106 areseparated.

Since the common pixel electrode 128 allows light generated by the lightemitting layer 130 to pass through, it is preferred that the commonpixel electrode 128 is formed from a transparent conductive film such asITO (indium doped with tin oxide) or IZO (indium doped with zinc oxide)having translucent properties and conduction properties. Alternatively,a metal film with a thickness which allows emitted light to pass throughmay be formed as the common pixel electrode 128.

It is possible to effectively block moisture from infiltrating the lightemitting layer 130 by arranging a first sealing region as in the presentembodiment. As a result, it is possible to improve resistance tomoisture and provide a display device 100 with a high level ofreliability. Furthermore, by arranging double structure in which amoisture infiltration path is blocked together with a second sealingregion, it is possible to further effectively block the infiltration ofmoisture.

The common pixel electrode 128 is arranged in common with a plurality ofpixels 108 and extends to the periphery edge part of the substrate 102.The common pixel electrode 128 and a low potential power supply wire 129are conductive in a cathode contact 118 arranged in the periphery edgepart of the substrate. As is shown in FIG. 2, the cathode contact 118may also be arranged in a plurality of places of the periphery edgepart. In addition, in the present embodiment, although the cathodecontact 118 is shown being arranged in a periphery edge part, thepresent embodiment is not limited to this arrangement, the cathodecontact 118 may also be arranged within the display region 106 or boththe display region 106 and a periphery edge part.

Although not shown in the diagram, in the case where the sealing layer142 is formed from a metal material, the low potential power source 129may be extended to below the sealing layer 142 and arranged to conductwith the cathode contact 118. In this case, the sealing layer 124operates as a dummy electrode. When the resistance of a wire itself orthe contact resistance between wires becomes high, the potentialdifference between the individual pixel electrode 126 and common pixelelectrode 128 becomes smaller compared to a voltage which shouldoriginally be applied due to a drop in voltage which leads to a problemwhere the amount of light emitted by the light emitting element 124drops (shading). However, by adopting this type of structure, it ispossible to reduce the space between the display region 106 and cathodecontact 118, improve control of a potential of the common pixelelectrode 128 and suppress shading.

Auxiliary electrodes 135 may be arranged below the individual pixelelectrode 126 via the insulation layer 136. It is possible to form acapacitances holding a video signal by using the individual pixelelectrode 126, insulation layer 136 and auxiliary electrode 134.Furthermore, if a structure in which the auxiliary electrode 134 coversa planarizing film 133 is adopted, it is possible to suppress moisturefrom the planarizing firm 133 from infiltrating the light emitting layer130, Furthermore, moisture blocking properties are further improvedsince it is possible to completely cover the bank 135 extending from theexterior side of the display region 106 using the auxiliary electrode13, sealing layer 142 and common pixel electrode 128.

The second sealing region 120 is arranged so as to enclose the displayregion 106. As can be seen from the cross-sectional view shown in FIG.3, the bank 135 and planarizing film 133 are removed within the secondsealing region 120, and the planarizing film 133 and bank 135 aredivided with the second sealing region 120 as the boundary. When anorganic element is used for the bank 135 or planarizing film 133, theorganic element becomes a path for propagating moisture, moisture whichhas infiltrated from the exterior reaches as far as the light emittingelement 124 which is likely to degrade the display device 100. As aresult, the second sealing region 120 is arranged for opening both thebank 135 and planarizing film 133, and an organic film is divided by theinterior and exterior which is effective for breaking a propagation pathfor moisture. An inorganic insulation film is suitable for an insulationfilm 198 which covers a gate insulation film 196 of the transistor 122and a gate electrode of the transistor 122. In the sealing region 120,the insulation layer 136, auxiliary electrode 134, gate insulation film196, insulation film 198, common pixel electrode 128 and sealing film138 have a form so that an inorganic insulation film, metal material ororganic metal compound material mutually contact. Moisture infiltrationfrom the exterior of the sealing region 120 is prevented by adoptingthis structure. A material basically formed using an organic insulationfilm such as the bank 135 and planarizing film 133 prevents theinfiltration of moisture by being removed from the sealing region 120.

The sealing film 138 is arranged above the common pixel electrode 128.It is preferred that the sealing film 138 is an insulation film whichcan block the infiltration of moisture. An inorganic insulation film canbe used as the insulation film. The sealing film may also have amultilayer structure or a structure in which an organic insulation filmis sandwiched by inorganic insulation films.

For example, in the case of using an inorganic insulation film as theinsulation film, it is possible to use silicon oxide (SiOx), siliconnitride (SiNx), silicon oxynitride (SiOxNy), nitride oxide silicon(SiNxOy), aluminum oxide (AlOx), aluminum nitride (AlNx), aluminumoxynitride (AlOxNy), aluminum nitride oxide (may use a film of AlNxOy)and the like (x, y are arbitrary). A structure in which these films arestacked may also be used. It is possible to use a plasma CVD method orsputtering method as a film formation method.

In the case where an organic insulation film is used as the insulatingfilm, it is possible to use a polyimide resin, an acrylic resin, anepoxy resin, a silicone resin, a fluorine resin and a siloxane resin andthe like. It is also possible to use a stacked structure of thesematerials, A vapor deposition method or vapor deposition polymerizationmethod may be used as the film forming method.

Furthermore, a stacked structure in which the inorganic insulation filmsand organic insulation films described above are combined may be used asthe sealing film 138.

A transparent opposing substrate 104 is covered while maintaining a gapwith the first substrate 102 by the third sealing region 110 in thefirst substrate 102. A filler 140 comprised from a transparent epoxyresin is filled in the space which is enclosed by the opposing substrate104, third sealing region 110 and sealing film 138.

The display device 100 shown in the present embodiment has what iscalled a top emission type structure in which light emitted by the lightemitting element 124 is emitted to the common pixel electrode 128 side.Although a top emission type structure is exemplified in the presentembodiment, the present invention is not limited to a top emission typestructure. It is also possible to apply a bottom emission type structurein which light is emitted to the individual pixel electrode 126 side.

The display device 100 according to the present embodiment ischaracterized by arranging the sealing layer 142 in the periphery of apixel 108 in addition to the individual pixel electrode 126 which formsa pixel 108. It is possible to separate the light emitting layer 130 andbank 135 or planarizing film 133 which are organic films by covering thelight emitting layer 130 which is arranged between the sealing layer 142and common pixel electrode 128 arranged on an upper layer, block amoisture infiltration path to the light emitting layer 130, and providethe display device 100 with a high level of reliability. In addition,moisture blocking properties and reliability of the display device 100are further improved by arranging the second sealing region 120.

Furthermore, in the manufacturing process of the display device 100related to the present embodiment, it is possible to separate the lightemitting layer 130 from bank 135 and planarizing film 133 which areorganic films just using a structural change without a large processchange. For example, it is possible to form the sealing layer 142 in thesame process as the individual pixel electrode 126 and a depositionrange of the light emitting layer 130 may be changed by changing anopening region of a film formation mask.

Modified Example 1

A schematic structure of a display device 200 related to a modifiedexample of the present embodiment is explained while referring to FIG. 4and FIG. 5. FIG. 4 is a planar view diagram showing a schematicstructure of the display device 200 related to a modified example of thepresent embodiment. FIG. 5 is a cross-sectional diagram showing aschematic structure of the display device 200 related to a modifiedexample of the present embodiment.

The display device 200 according to the present modified example isdifferent only in the layout of sealing layer 142 and the layout of thelight emitting layer 130 compared to the display device 100 of thepresent embodiment. In the display device 200 according to the presentmodified example, the sealing layer 142 extends more to the vicinity ofthe second sealing region 120 and the light emitting layer also extendsin a similar manner compared to the display device 100 according to thepresent embodiment. The sealing layer 142 has a closed periphery shapeand the width is preferred to be 250 μm or more and 500 μm or less.However, the width is preferred to be set according to the positionalaccuracy of the light emitting layer 130, and it is possible to set thewidth to a position and width which encompasses the entire range ofpositional variation of an end part of the light emitting layer 130. Theend part of the light emitting layer 130 is preferred to extend within aregion of 20 μm or more and 250 μm or les to the exterior side of thedisplay region 106 from a pixel arranged on the outermost peripheryamong the plurality of pixels arranged in a matrix shape. In this way,it is possible to secure a wide design margin with respect to positionalaccuracy when patterning the light emitting layer 130.

Modified Example 2

A schematic structure of a display device 300 related to a modifiedexample of the present embodiment is explained while referring to FIG. 6and FIG. 7. FIG. 6 is a planar view diagram showing a schematicstructure of the display device 300 related to a modified example of thepresent embodiment. FIG. 7 is a cross-sectional diagram showing aschematic structure of the display device 300 related to a modifiedexample of the present embodiment.

The display device 300 according to the present modified example isdifferent compared to the display device 100 of the present embodimentin that a separation region 210 which separates the bank 135 is includedbetween the sealing layer 142 and second sealing region 120. In thisway, it is possible to break a propagation path of moisture triply,further improve moisture blocking properties and provide a displaydevice with a high level of reliability.

Modified Example 3

A schematic structure of a display device 400 related to a modifiedexample of the present embodiment is explained while referring to FIG. 8and FIG. 9. FIG. 8 is a planar view diagram showing a schematicstructure of the display device 400 related to a modified example of thepresent embodiment. FIG. 9 is a cross-sectional diagram showing aschematic structure of the display device 400 related to a modifiedexample of the present embodiment.

The display device 400 according to the present modified example isdifferent to the display device 100 of the present embodiment in that itincludes the second sealing region 120. Since it is possible to securemoisture blocking properties by a structure in which the light emittinglayer 130 is separated from the bank 135 outside the display region 106and the planarizing film 133 using the sealing layer 142 and commonpixel electrode 128, the second sealing region 120 is not alwaysrequired. In addition, it is possible to break a water propagation pathby including the separation region 120 which separates the bank 135. Inthis way, it is possible to secure a wide display region 106 compared tothe display devices 100, 200 and 300 described previously and achieve anarrow framed display device 400.

Modified Example 4

A schematic structure of a display device 500 related to a modifiedexample of the present embodiment is explained while referring to FIG.10. FIG. 10 is a cross-sectional diagram showing a schematic structureof the display device 500 related to a modified example of the presentembodiment.

Compared to the display device 100 of the present embodiment the displaydevice 500 related to the present modified example is different in thatthe structure of the light emitting layer 130 is different. The displaydevices 100 to 400 described above use a method for realizing a fullcolor by arranging a light emitting layer which emits white light and acolor filter. In the present modified example, an individual lightemitting layer of a red light emitting layer, green light emittinglayer, blue light emitting layer and white light emitting layer arecoated in a sub-pixel of each pixel 108. The individual light emittinglayer extends as far as above the sealing layer 142 arranged outside thedisplay region 106. An end part of the individual light emitting layeris covered by the sealing layer 142 and common pixel electrode 128 andthereby becomes separated from the bank 135 or planarizing film 133outside of the display region 106.

Furthermore, the present modified example is obviously not limited tothe display device and the display devices 200 to 400 may be combined.

The preferred forms of the present invention were explained above usingthe display devices 100 to 500. However, these are merely examples andthe technical scope of the present invention should not be limited tothese embodiments. A person ordinarily skilled in the art could carryout various modifications without departing from the gist of the presentinvention. Therefore, those modifications should also be interpreted asbelonging to the technical scope of the present invention.

What is claimed is:
 1. A semiconductor device comprising: a firstsubstrate; a TFT layer arranged on the first substrate, the TFT layerincluding thin film transistors and an inorganic insulation film; afirst organic insulation layer on the TFT layer; a first electrode layerarranged on the first organic insulation layer, the first electrodelayer including first electrodes and a first conductive film; a secondorganic insulation layer arranged on the first electrode layer, thesecond organic insulation layer having openings which expose uppersurfaces of the first electrodes, a second electrode layer arranged onthe second organic insulation layer, the second electrode layerincluding a transparent conductive material; and a sealing layer on thesecond electrode layer, wherein the first electrodes are arranged in amatrix form, a first recess surrounding the first electrodes is formedin the first organic insulation layer and the second organic insulationlayer, a second recess surrounding the first electrodes is formed in thesecond organic insulation layer, a third recess between the firstelectrodes and the first recess is formed in the second organicinsulation layer, the first conductive film is exposed from the secondorganic insulation layer in the second recess and the third recess, andthe second electrode layer is in contact with the first conductive filmthrough the second recess or the third recess.
 2. The semiconductordevice according to claim 1, wherein the first recess surrounds thefirst electrodes continuously.
 3. The semiconductor device according toclaim 1, wherein the second recess has a plurality of parts, and one ofthe plurality of parts of the second recess and another one of theplurality of parts of the second recess are spaced apart from eachother.
 4. The semiconductor device according to claim 1, furthercomprising a second substrate and a seal material between the firstsubstrate and the second substrate, the seal material being in contactwith both of the first substrate and the second substrate, wherein theseal material surrounds the first electrodes, the seal material and thefirst organic insulation layer do not overlap each other in a planarview, and the seal material and the second organic insulation layer donot overlap each other in the planar view.
 5. The semiconductor deviceaccording to claim 1, further comprising a light emitting part betweenone of the first electrodes and the second electrode.
 6. Thesemiconductor device according to claim 5, wherein the light emittingpart includes an organic light emitting layer.